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High-Density Interconnect PCBs (HDI PCBs)

Essential for high-speed signals and applications

High-Density Interconnect PCBs (HDI PCBs) deliver a significantly higher wiring density than standard through-hole PCBs, enabling innovative and compact electronic designs. As outlined by IPC-6012 standards, these PCBs provide 20 or more electrical connections per square centimetre on each side, making them ideal for sophisticated and space-saving applications.

HDI PCB Ortho View
HDI PCB Visual Layout

The HDI approach allows for the creation of smaller, lighter, and highly reliable electronic products by integrating advanced features such as multiple layers, precise traces, microvias, and blind or buried vias. With HDI technology, shorter signal pathways reduce power loss and enhance electrical performance. This makes HDI PCBs essential for high-speed signals and applications requiring exceptional signal integrity in cutting-edge industries.

Key Characteristics of HDI PCBs

HDI PCBs adhere to IPC-2226 guidelines, incorporating design elements that enhance their functionality:

  • Blind and Buried Vias: Specialised vias connect specific PCB layers without extending through the entire board, maximising space efficiency and offering greater design flexibility.
  • Fine Line Widths and Spacing: Tracks and gaps narrower than 100µm support higher component density.
  • Microvias: Small laser-drilled vias, typically less than 150 µm in diameter, enable efficient interconnections between layers.
  • Multi-Layer Structures: Stacked, staggered, or sequentially laminated layers optimise the PCB's capacity to accommodate complex circuitry.
Microvia

HDI PCBs represent a key advancement in PCB technology, meeting the growing demand for compact, high-performance electronics in sectors like telecommunications, aerospace, automotive, and medical devices. Their innovative design features and exceptional electrical performance make them an essential solution for modern electronic applications. If you're seeking high-quality HDI PCBs tailored to your specific requirements, get in touch with our team at TCL to discuss your project.

HDI Capabilities

Feature Technical Specification
Max Layer Count 22, advanced 50
PCB Thickness 0.3mm - 4.5mm
PCB Size 50 x 50mm - 700 x 600mm
Max Copper Thickness Outer layer:6OZ Inner layer: 6OZ
Minimum Hole Size 0.1mm, advanced 0.075MM
Max Hole Size 3.5mm
Tighest Hole Tolerence PTH:±0.075MM, NPTH:±0.05MM
Min Track Width 0.762mm
Min Gap 0.762mm
Finishes OSP, ENIG, ENEPIG, EPAG, Immersion tin, Immersion Silver

HDI Sample

  • 3 sequential lamination cycles
  • 5 buried via drill stages, 2 blind via drill stages, 1 plated through drill stage
  • 100um track and gap internal layers
  • 125um track and 100um gap external layers
  • Copper filled blind vias
  • Enig finish
  • High Tg FR4
HDI PCBsHDI PCB Specification Chart