At TCL, we’re passionate about pushing the boundaries of PCB technology to meet the evolving needs of our customers. A key innovation in this area is embedding semiconductor dies and CoolMOS packages directly into the PCB - offering exciting possibilities beyond traditional approaches.
By embedding components directly into the PCB, we not only improve performance and reliability but also open the door to greater design flexibility and potential cost savings. It’s an approach that’s particularly useful for high-performance and space-constrained applications.
While we can’t share specific project details due to NDAs, our Technical Sales Team is always available to discuss how we can help bring these innovations into your next project.