PCBs designed for RF (Radio Frequency) and microwave applications are engineered to manage exceptionally high-frequency signals, spanning from megahertz (MHz) to gigahertz (GHz). These specialised circuits require advanced design techniques to reduce signal degradation, interference, and distortion when operating at such elevated frequencies.
Advanced Materials for High-Performance PCBs
Standard FR4 materials are inadequate for frequencies beyond 1 GHz due to their greater losses and inconsistent dielectric properties. High-frequency PCBs demand unique materials to ensure optimal performance. At our sister company, we produce high-performance RF and microwave PCBs, either locally in the UK or through trusted manufacturing partners in Asia. Our expertise serves a wide range of industries, including aerospace, defence, and telecommunications. Each PCB is meticulously crafted to meet the rigorous demands of high-frequency environments, ensuring exceptional reliability and performance, even in challenging conditions.
Medical
RF/microwave PCBs are integral to advanced medical imaging technologies, such as MRI scanners, which operate at frequencies like 123 MHz for proton imaging.
Consumer Electronics
Everyday wireless technologies, such as Bluetooth devices, smartphones, and Wi-Fi routers, rely on RF PCBs to deliver consistent and reliable signal transmission.
Radar Systems
RF PCBs are critical to radar technology in various fields:
Satellite Communication
High-frequency PCBs play a crucial role in satellite systems, supporting Ku-band (12-18 GHz) operations while minimising signal loss during processing.
Specialised materials like Rogers, PTFE (Teflon), and ceramics are essential for manufacturing RF and microwave PCBs. These materials are carefully chosen for their ability to maintain signal integrity under demanding conditions.
With its high temperature and a very low CTE makes AlN suitable for a variety of applications including Semiconductors, High power LEDs, testing and sensors.
Key material properties include:
Producing RF and microwave PCBs requires precision to ensure high-frequency signal integrity.
Key considerations include:
By combining technical expertise, premium materials, and cutting-edge manufacturing, we deliver RF and microwave PCBs that excel in performance, reliability, and durability.
RF Microwave Capabilities
Feature | Specification |
---|---|
Layers | 2 - 50 |
Key features | Controlled impedance, low loss materials, miniaturisation |
Laminates | Rogers, Arlon, Neclo, Taconic, Ventec and Isola, PPO, Teflon, Ceramic filled |
Dielectric thickness | 0.1mm - 3.0mm |
Profiling | Routing, v-score |
Minimum track and gaps | 0.075mm / 0.075mm (+/- 10% as per IPC) |
Maxmimum dimensions | 700mm x 600mm |
Material thickness | 0.4mm - 5.4mm |
Surface finishes | HASL (Lead-free), OSP, ENIG, ENIPIG, Immersion tin, Immersion silver |
Minimum laser drill | 0.10mm standard, advanced NPTH ±0.05MM PTH:±0.075MM |